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DesigN Analysis - Infrastructure

Earl J. Lum
+1-650-430-2221
elum@ejlwireless.com

Ericsson DRU GSM/EDGE 900MHz


Model KRC 161094/1 R3D
April 2010

Entire contents 2010 EJL Wireless Research LLC. All Rights Reserved. Reproduction of this publication in any form without prior
written permission is strictly forbidden and will be prosecuted to the fully extent of US and International laws. The transfer of this
publication in either paper or electronic form to unlicensed third parties is strictly forbidden. The information contained herein has
been obtained from sources EJL Wireless Research LLC deems reliable. EJL Wireless Research LLC disclaims all warranties as to
the accuracy, completeness or adequacy of such information. EJL Wireless Research LLC shall have no liability for errors,
omissions or inadequacies in the information contained herein or for the interpretation thereof. The reader assumes sole
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change without notice.

2010 EJL Wireless Research LLC. All Rights Reserved


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TABLE OF CONTENTS
EXECUTIVE SUMMARY ....................................................................... 5

Active/Passive Component Summary ................................................................ 5


Important Note: ............................................................................................ 5

CHAPTER 1: RBS 2X16 SYSTEM .......................................................... 6

1.1 Overview of Ericsson RBS 2x16 and DRU ..................................................... 6

CHAPTER 2: MECHANICAL ANALYSIS ...................................................... 9

2.1 Mechanical Analysis .................................................................................. 9

CHAPTER 3: DRU TRANSCEIVER SYSTEM .............................................. 15

Area A: Transceiver Power Management...........................................................18


Area B: Transceiver Baseband Processing .........................................................20
Area C: Connectors .......................................................................................22
Area D: A/D Conversion .................................................................................23
Area E: Receiver ...........................................................................................25
Area E1: Receiver Input/Output Switch Combiner Matrix ....................................27
Area E2: Receiver 1 / 2 RF Filtering/Down Conversion ........................................31
Area E3: Receiver VCO Section .......................................................................33
Area E4: Receiver IF Section ..........................................................................35
Area F: Transmitter Path 1 .............................................................................37
Area G: Transmitter Path 2.............................................................................40
Area H: RF Power Amplifier Power Management ................................................42
Area I1: RF Power Amplifier 1 .........................................................................44
Area I2: RF Power Amplifier 2 .........................................................................51
RYT 902 6062/10 R1A ...................................................................................53
RYT 902 6062/3 R1B .....................................................................................55

CHAPTER 4: RF DUPLEXER FILTERS .................................................... 57


APPENDIX A - PASSIVE CASE SIZE ANALYSIS.......................................... 62
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS ...................... 66

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2010 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

TABLES
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1: Area A Bill of Materials ..................................................................................................... 19


2: Area B Bill of Materials ..................................................................................................... 21
3: Area C Bill of Materials ..................................................................................................... 22
4; Area D Bill of Materials ..................................................................................................... 24
5: Area E1 Bill of Materials ................................................................................................... 30
6: Area E2 Bill of Materials ................................................................................................... 32
7: Area E3 Bill of Materials ................................................................................................... 34
8: Area E4 Bill of Materials ................................................................................................... 36
9: Area F Bill of Materials ..................................................................................................... 39
10: Area G Bill of Materials ................................................................................................... 41
11: Area H Bill of Materials ................................................................................................... 43
12: Area I1 Bill of Materials .................................................................................................. 50
13: Area I2 Bill of Materials .................................................................................................. 52
14: RYT 902 6062/10 R1A Bill of Materials.............................................................................. 54
15: RYT 902 6062/3 R1B Bill of Materials ............................................................................... 56
16: RF Duplexer Filter Protection Circuit Bill of Materials........................................................... 61
17: Passive Component Case Size Distribution by System Subsection ........................................ 63
18: Identified Passive Component Supplier Distribution by System Subsection ............................ 64
19: Active/Passive Component Distribution by System Subsection ............................................. 65
20: Active Semiconductor Vendor Distribution by System Subsection......................................... 67

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2010 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

EXHIBITS
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1: dTRU vs. DRU Integration within RBS2000 BTS Platform ...................................................... 6


2: RBS 2x16 Radio System Block Diagram.............................................................................. 7
3: DRU Block Diagram ......................................................................................................... 8
4: DRU Faceplate Layout and Dimensions ............................................................................... 9
5: DRU Front and Rear View ............................................................................................... 10
6: DRU Top Side and Bottom Side View................................................................................ 11
7: Top View of DRU with RF Duplexer Filter .......................................................................... 12
8: DRU Heat Sink Mechanical Dimensions, Side View ............................................................. 13
9: DRU Heat Sink, Top View ............................................................................................... 14
10: DRU Heat Sink, Bottom View......................................................................................... 14
11: DRU Transceiver System Printed Circuit Board (Top View) ................................................ 16
12: DRU Transceiver System Printed Circuit Board (Bottom View) ........................................... 17
13: Area A Component Diagram .......................................................................................... 18
14: Area B Component Diagram .......................................................................................... 20
15: Area C Component Diagram .......................................................................................... 22
16: Area D Component Diagram.......................................................................................... 23
17: Area E Diagram ........................................................................................................... 25
18: DRU Receiver Block Diagram......................................................................................... 26
19: Area E1 Component Diagram ........................................................................................ 27
20: DRU Capacity Configurations ......................................................................................... 28
21: DRU Coverage Configurations........................................................................................ 29
22: Area E2 Component Diagram ........................................................................................ 31
23: Area E3 Component Diagram ........................................................................................ 33
24: Area E4 Component Diagram ........................................................................................ 35
25: RF Transmit Path Block Diagram.................................................................................... 37
26: Area F Component Diagram .......................................................................................... 38
27: Area G Component Diagram.......................................................................................... 40
28: Area H Component Diagram.......................................................................................... 42
29: RF Power Amplifier Tx Chain Block Diagram .................................................................... 44
30: RF Output Circuit, Separate Output Configuration ............................................................ 45
31: RF Output Circuit, Power Combiner Configuration ............................................................ 46
32: RF Output Module w/PCB Inserted, Top and Bottom Views ................................................ 47
33: RF Output Module w/PCB Removed, Top and Bottom Views............................................... 47
34: PCB Circuit, Top and Bottom View.................................................................................. 48
35: Area I1 Component Diagram ......................................................................................... 49
36: Area I2 Component Diagram ......................................................................................... 51
37: RYT 902 6062/10 R1A Component Diagram .................................................................... 53
38: RYT 902 6062/10 R1A Component Diagram .................................................................... 55
39: DRU RF Shield and Duplexer Input/Output Locations........................................................ 57
40: RF Duplexer Filter Cover, Top View ................................................................................ 58
41: RF Duplexer Filter Cover, Bottom View ........................................................................... 58
42: Duplexer Filter RF Paths ............................................................................................... 59
43: RF Duplexer Filter Input Protection Component Diagram................................................... 60
44: Passive Component Case Size Distribution ...................................................................... 62
45: Identified Passive Component Market Share by Vendor .................................................... 65
46: Active Semiconductor Component Share......................................................................... 66
47: Active Semiconductor Market Share by Vendor ................................................................ 68
48: High Pin Count (64+) Active Semiconductor Market Share by Vendor................................. 68

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2010 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

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