Evolution to New Thin Film Products

TDK Corporation
16th /November/ 2012

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

The Evolution to New Thin Film Products

TDKs Thin Film Process technology
TCM / TCE used thin film Inductor technology

Z-Match (Thin Film Capacitor)

The worlds first ferrite core (Year1935) TDK-EPCs Device Design technologies

TRA (Thin Film resistor)

TFS (Thin Film Solution) / SAW / BAW (RF Filters)

BPF

Coupler / Balun

SAW/BAW

SESUB (Semiconductor Embedded in SUBstrate)

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Future Passives Thin Film Technology

Thin film power coil Z-Match (Thin Film Capacitor)

Thin Film Common Mode Filter with built-in ESD protection

Thin Film RF components

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

Background of TFS Series Products

(Thin Film Common Mode Filter) Since 2003 HDD Head Technology Since 1986

TCM

Conventional LTCC (Low Temp. Co-fired Ceramics)

Thick-film : process limitation (L/S ~50um )
Much Smaller and Thinner

Thin Film Process Technology L/S <1um

TFS (Thin Film Solution)

BPF LPF Diplexer Coupler Balun

Thin film process technology has adapted to TFS series

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Z-match (Capacitor)

RF Capacitor
Background Performance and Deviation of RF circuit to be critical in higher frequency Every capacitor has ESR and ESL. For high frequency (GHz) applications, lower ESR is required in order to reduce loss. For high frequency (GHz) applications, narrow tolerance is also required in order to reduce loss by impendence(Z) miss matching.
equivalent capacitor circuit
Capacitance Low ESR Low ESL

RF Capacitor by Thin film process

MLCC

ESL

ESR ESR= electrode resistance + dielectric loss electrode material Q=1/DF (loss tangent) electrode thickness electrode width skin depth
TDK-EPC Corporation Systems Acoustics Waves Business Group

ESR (equivalent series resistance) ESL (equivalent series inductance)

Copyright 2011 TDK-EPC Corporation. All rights reserved.

Z-match (Capacitor)

Thin Film Capacitor (Z-match)

- TFSQ 01005(0402mm) Series e g e
L 0.400.02mm 0.200.02mm 0.200.02mm

Dimensions

Recommended Land Pattern

0.20 0.20 0.20

W T e

g h

0.150.01mm 0.170.01mm

Unit : mm

Features
01005 (0402mm) size with bottom terminal design (0.40mm x 0.20mm x 0.20mm ) Tight tolerance (+/- 0.05pF) 0.1pF step lineup High Q (Low ESR and High SRF) performance 16V withstanding voltage C0H temperature coefficient
Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

0.20

0.110.01mm

Z-match (Capacitor)

Comparison of SRF and ESL

SRF and ESL
Cap Value SRF ESL@1GHz
0

S-parameter measurement: Shunt-Thru mode TRL Calibration

Z-match (01005(0402mm)size) 0.7pF 11.086GHz 0.29nH 2.2pF 6.350GHz 0.275nH

0

Typical MLCC (01005(0402mm)size) 0.7pF 10.087GHz 0.308nH 2.2pF 5.955GHz 0.302nH

0.7pF
-10
-10

2.2pF

S21 (dB)

S21 (dB)

-20

-20

-30

-30

-40
2 3 4 5

MLCC
1
6 7 8 9

Z-match
10
2

-40
2 3

MLCC
1
4 5 6 7 8

Z-match
9

10

Frequency (GHz)

Frequency (GHz)

Z-match shows Higher SRF and Lower ESL than MLCC

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Z-match (Capacitor)

Evaluation result with 3.5GHz PA Module (WiMAX)

WiMax Module PA Matching Circuit
-15
Vbias Vcc

EVM and Gain characteristics

Freq.=3.5GHz
TFSQ0402 TFC 0402
MLCC 0402 by A company MLCC 1005 by A company

12 11
3.0dB

-20 EVM (dB) -25 -30 -35 -40 -45

EVM Spec.

1.5nH 10pF Pin Pout 0.4nH 0.5pF Bare chip 1.8pF 0.7pF

9
Gain

0.5dB

8 7 6

EVM

0.5pF,1.8pF and 0.7pF TFC are used for impedance matching

15

20 25 Pout dBm)

30

EVM: TFC is about 3.0dB lower than MLCC 0402mm (equal to MLCC 1005mm) at Pout=26dBm. Gain: TFC is about 0.5dB higher than MLCC 0402mm and 1005mm at Pout=26dBm.
Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Gain (dB)

10

Z-match (Capacitor)

Z-match(TFSQ0402 Series) Products Line up

Cap (pF) Temp.. Coeff. WV (V) Tolerance 0.05pF W W W W W W W W W W W W W W W W W W W W W W W W W W W W W 0.1pF 0.25pF Cap (pF) 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 Temp. Coeff. WV (V) Tolerance 0.05pF W W W W W W W W W W W W W W W W W W W W W W W W W W W W W 0.1pF B B B B B B B B B B B B B B B B B B B B B B B B B B B B B 0.25pF

MP April, 2011

0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0

MP ul., 201

16

C0H

16

C0H

B B B B B B B B B B

TBD

C C C C C C C C C C C C C C C C C C C C C C C C

TBD

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

TFS Series Products Line up

Thin-Film Balun Transformers
Photo Sereis TFSZ Sereis Dimensions (LxWxT) mm Applications 2.4GHz W-LAN / Bluetooth 0.65 x 0.50 x 0.25 5GHz W -LAN ( 0.026 x 0.020 x 0.010 inch ) WiMAX

Thin-Film Directional Couplers

Photo Sereis Dimensions (LxWxT) mm Applications Cellular 0.65 x 0.50 x 0.25 2.4GHz W-LAN ( 0.026 x 0.020 x 0.010 inch ) WiMAX TFSC Sereis

NEW
1.0 x 0.5 x 0.3 Cellular ( 0.039 x 0.020 x 0.012 inch)

Thin-Film Band Pass Filters

Photo Sereis Dimensions (LxWxT) mm 1.0 x 0.5 x 0.3 ( 0.039 x 0.020 x 0.012 inch) Applications 2.4GHz W-LAN / Bluetooth TFSB Sereis 5GHz W -LAN WiMAX

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

TFS Series Products Line up

Thin-Film Diplexer
Photo Sereis

NEW
Dimensions (LxWxT) mm Applications 1.0 x 0.5 x 0.3 ( 0.039 x 0.020 x 0.012 inch)

TFSD Sereis

W-LAN

Thin-Film Low Pass Filters

Photo Series

NEW
Applications Cellular Band

Dimensions (LxWxT) mm

TFSL Series

0.65 x 0.50 x 0.25 (0.026 x 0.020 x 0.010 inch) 2.4GHz W-LAN/Bluetooth

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

New Thin Film Solution for WiFi/Bluetooth

WLAN Module

LGA

LGA

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

Features of TFS

Smaller RF characteristics deviation Improvement for stability of set characteristics

Coupling
-15 -17 -19

Comparison graph of RF characteristics deviation (Example for Directional Coupler) Blue Line : TFS Red Line : TDKs LTCC Comparison Item Directional Coupler Pass Band Frequency 2.4-2.5GHz fired Ag : =2.5ucm Sample Size n=30
dB

Insertion Loss
0 -0.05 -0.1 dB -0.15 -0.2 -0.25 -0.3

-21 -23 -25 2.2 2.3 2.4 2.5 Frequency (GHz) 2.6 2.7

Coefficient of variation TFS = 1.3% LTCC = 2.7%

Coefficient of variation TFS = 2.4% LTCC = 4.9%

2.2 2.3 2.4 2.5 Frequency (GHz) 2.6 2.7

5um
Isolation

VSWR
1.4

Inner Electrode
-30 dB

-20

Coefficient of variation TFS = 8.6% LTCC = 11.3%

1.3

Coefficient of variation TFS = 0.3% LTCC = 1.7%

-40

1.2

-50

1.1

-60 2.2 2.3 2.4 2.5 Frequency (GHz) 2.6 2.7

1 2.2 2.3 2.4 2.5 Frequency (GHz) 2.6 2.7

Smaller RF Characteristics Deviation

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group 14

Thin Film Solution

Thin Film coupler (TFSC0605 series)

Red: Typical LTCC coupler Coupling
Coupling [dB]

Comparison with LTCC Frequency Response

Blue: TDK-EPCs Thin Film Coupler Insertion Loss
0
Insertion Loss [dB]

UMTS Band5 (824-849MHz)

0 5 10 15 20 25 30 35 800

Lower Insertion Loss

0.1

0.2

0.3

820

840 Frequency [MHz]

860

880

0.4 800

820

840 Frequency [MHz]

860

880

Insertion Loss [dB]

UMTS Band1 (1.92-1.98GHz)

Coupling [dB]

0 5 10 15 20 25 30 1850

Lower Insertion Loss

0.1 0.2

0.3

1900

1950 Frequency [MHz]

2000

2050

0.4 1850

1900

1950 Frequency [MHz]

2000

2050

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

TRP improvement in RF circuit (HSDPA/HSUPA

High Directivity Coupler on each WCDMA PA line
Problem Miss matching loss between antenna and coupler in each frequency band with OTA measurement.

Thin Film Solution

Wide Band Coupler on between antenna and SW

Solution Wide Band coupler can control more accurate antenna power with OTA measurement.
GSM Low

GSM Low

GSM High GSM Low GSM High

PA PA

GSM High GSM Low GSM High

SW
PA Coupler PA

PA PA

SW

Wide Band Coupler

WCDMA850

WCDMA850

WCDMA1900

PA

Coupler

WCDMA1900

PA

WCDMA2100

PA

Coupler

WCDMA2100

PA

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

Wide Band Coupler with Attenuators

Existing solution
Antenna coupling Input Antenna coupling

New

Thin Film coupler + Thin Film attenuators

Input

Isolation

Isolation

Impedance of Isolation port changed: 50 / 100 / 200ohm

Coupling variation: 0.37dB Coupling_200ohm
-20 -20.5 -21 -21.5 -22 -22.5 -23 1.5 1.6 1.7 1.8 Frequency (GHz) 1.9 2

-30

Coupling variation: 0.04dB Coupling_200ohm_10dB_attenuator

1.75 GHz -21.45 dB

200 200 100 100 50 50

1.75 GHz -21.83 dB
DB(|S(3,1)|) T FSC06054125_2113A1 DB(|S(3,1)|) 2113A1_imp DB(|S(7,5)|) 2113A1_imp

-30.5 -31 -31.5 -32 -32.5 -33 1.5 1.6 1.7 1.8 Frequency (GHz) 1.9 2

1.75 GHz -31.79 dB

200 100 50
DB(|S(3,1)| ) 21 13A1_At t10dB_ imp DB(|S(7,5)| ) 21 13A1_At t10dB_ imp DB(|S(11,9)| ) 21 13A1_At t10dB_ imp

1.75 GHz -31.83 dB

Attenuators suppress the coupling drift by impedance change at isolation port.

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Wide Band Coupler with TFS and TRA

Existing solution
Antenna coupling Input Isolation

Thin Film Solution

Thin Film coupler + Thin Film resistor

Antenna coupling Input Isolation

Thin Film Coupler + Resistor x 6pcs Thin Film Coupler +TRA

0.5mm

Size:1.0x0.5mm t=0.30mm typ. 6terminal LGA

0.65mm
ANT GND 200um CPL GND IN 200um ISO

0.3mm 0.6mm

0.5mm

1.0mm Terminal Size:190x90um

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

Thin-Film Coupler

-TFSC 0605 Series-

Products Lineup for Cellular Band

Application Frequency (MHz) TFSC Product Name
TFSC06051950-2107A6

Coupling (dB) 15.4 +/- 1 16.6 +/- 1 18.8 +/- 1 22.6 +/- 1 15.7 +/- 1 16.9 +/- 1 19.1 +/- 1 22.9 +/- 1 22.5 +/- 1 23.7 +/- 1 26.0 +/- 1 29.9 +/- 1

Ins. Loss (dB) Min Typ. 0.26 0.22 0.16 0.09 0.26 0.21 0.15 0.09 0.13 0.12 0.10 0.07 Max 0.4 0.4 0.3 0.3 0.4 0.4 0.3 0.3 0.3 0.3 0.3 0.3 Min -

VSWR Typ. 1.02 1.01 1.01 1.02 1.04 1.02 1.01 1.02 1.03 1.02 1.02 1.01 Max 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2

Directivity (dB) Min 20 20 20 20 20 20 20 20 20 20 20 20 Typ. 32.4 27.7 23.3 28.2 32.3 27.3 23.1 27.9 31.4 25.5 22.2 26.2 Max -

UMTS BAND 1 Tx

1920 - 1980 (1950)

TFSC06051950-2108A6 TFSC06051950-2109A6 TFSC06051950-2110A6 TFSC06051880-2107A4

UMTS BAND 2 Tx

1850 - 1910 (1880)

TFSC06051880-2108A4 TFSC06051880-2109A4 TFSC06051880-2110A4 TFSC06050836-2107A1

UMTS BAND 5 Tx

824-849 (836.5)

TFSC06050836-2108A1 TFSC06050836-2109A1 TFSC06050836-2110A1

Note: The above Specifications are subject to change without notice.

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

Thin-Film Coupler
Frequency (MHz) TFSC Product Name
TFSC06052450-2108AC

-TFSC 0605 Series-

Products Lineup for W-LAN & WiMAX

Application Coupling (dB) 14.6 +/- 1 16.9 +/- 1 20.7 +/- 1 15.0 +/-1.2 21.5 +/- 1.5 TFSC06053925-2111B3 15.0 +/- 1.0 19.0 +/- 1.5 TFSC06053925-2113A1 12.5 +/- 1.5
TFSC06052500-2108AD

Ins. Loss (dB) Min Typ. 0.29 0.19 0.10 0.23 0.09 0.20 0.11 0.41 0.30 0.21 0.10 0.47 0.31 0.13 Max 0.4 0.3 0.3 0.32 0.22 0.32 0.50 0.50 0.4 0.4 0.3 0.7 0.5 0.3 Min -

VSWR Typ. 1.04 1.03 1.03 1.17 1.05 1.10 1.05 1.10 1.04 1.03 1.04 1.11 1.13 1.02 Max 1.2 1.2 1.2 1.3 1.3 1.3 1.3 1.3 1.2 1.2 1.2 1.2 1.2 1.2

Directivity (dB) Min 20 20 20 16 16 16 15 15 20 20 20 20 20 20 Typ. 29.1 25.4 33.3 23.4 22.2 20.9 21.5 21.3 29.5 25.8 33.5 24.1 26.4 26.6 Max -

W-LAN
(IEEE 802.11b/g)

2400 - 2500 (2450) 4900 -5950 (5425) 2400 - 2500 (2450) 4900 -5950 (5425) 2400 - 2500 (2450) 4900 -5950 (5425) 2300 - 2700 (2500)

TFSC06052450-2109AC TFSC06052450-2110AC

W-LAN
(IEEE 802.11a)

TFSC06055425-2111B1

NEW
W-LAN (Wide Band)

Wide Band

14.5 +/- 1.5 16.7 +/- 1.5 20.5 +/- 1.5 11.5 +/- 1.5 13.6 +/- 1.5 17.3 +/- 1.5

WiMAX 2.5G WiMAX 3.5G

TFSC06052500-2109AD TFSC06052500-2110AD TFSC06053600-2108AE

3300 - 3900 (3600)

TFSC06053600-2109AE TFSC06053600-2110AE

Note: The above Specifications are subject to change without notice.

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

Thin-Film Balun
Products Lineup
Applications Frequency Range (MHz)
2400 - 2500 (2450) TFSZ06052450-3302A1

-TFSZ SeriesAll Low Loss type

Unbalanced Balanced Impedance Impedance

NEW
Product Name

Insertion Return Phase Amplitude Loss Loss Differential Balance (dB) (dB) (deg.) (dB)
0.6 Max. 10 Min. 180 10 0 1.5

2.4GHz W-LAN/ Bluetooth

TFSZ06052450-3301B1

50 ohm

50 ohm

50 ohm

100 ohm

0.5 Max.

10 Min.

180 10

0 1.5

3.5GHz WiMAX

TFSZ06053600-3318A1 3300 - 3900 (3600) TFSZ06053600-3319A1 1930 - 1990 (1960) 1805 - 1880 (1842) 1805 - 1990 (1897) 2300 - 2690 (2495)

50 ohm

50 ohm

0.5 Max.

10 Min.

180 10

0 2.0

50 ohm

100 ohm

0.5 Max.

10 Min.

180 10

0 2.0

Band2 Rx Band3 Rx Band2/3 Rx Band40/ Band7 Rx

TFSZ06051960-3315A1

50 ohm

100 ohm

0.6 Max.

10 Min.

180 10

0 1.0

TFSZ06051842-3316A1

50 ohm

100 ohm

0.6 Max.

10 Min.

180 10

0 1.0

TFSZ06051897-3317A1

50 ohm

100 ohm

0.6 Max.

10 Min.

180 10

0 1.8

TFSZ06052460-3310A2

50 ohm

100 ohm

0.55 Max. 10 Min.

180 10

0 2.5

Note: The above Specifications are subject to change without notice.

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

Block Diagram for BPF Application

ANT

Example; for Bluetooth

Balun BPF
ANT SW

TX

Transceiver IC Balun
RX

BASE BAND

IC

Example; for W- LAN ( IEEE802.11a/b/g )

2.4GHz TX

ANT
Diplexer 5GHz Tx 2.4GHz Rx Diplexer 5GHz Rx

PA

BPF

Balun
TX

PA

BPF

Balun

ANT SW

RF IC

BPF

LNA

Balun
RX

BPF

LNA

Balun

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

Thin-Film Band Pass Filter

Products Lineup
Photo Dimensions (LxWxT)m m Applications 2.4GHz W-LAN / Bluetooth 2.5GHz WiMAX 5.0GHz W-LAN

-TFSB Series-

Product Name TFSB10052450-1101B2 TFSB10052450-1104B1 TFSB10052600-1105A1 TFSB10055375-1103A1

1.0 x 0.5 x 0.3 ( 0.039 x 0.020 x 0.012 inch)

Note: The above Specifications subject to change without notice.

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

Block Diagram for Diplexer Application

Example; for W- LAN ( IEEE802.11a/b/g )
NEW
2.4GHz TX

ANT
Diplexer 5GHz Tx 2.4GHz Rx Diplexer 5GHz Rx

PA

BPF

Balun
TX

PA

BPF

Balun

ANT SW

RF IC

BPF

LNA

Balun
RX

BPF

LNA

Balun

NEW

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

Thin-Film Diplexer
Products Lineup
Photo Dimensions (LxWxT)

-TFSD Series-

Applications

Product Name TFSD10055950-5001C1

1.0mmx0.5mmx0.3mm (0.039x0.020x0.012 inch)

For 2.4GHz /5GHz W-LAN TFSD10055950-5002A2

Application

Product Name

Freq.Ins.Loss Range1 MHz dB (max) MHz 2400 I 2500 2400 I 2496 0.50 4800 I 5000 4900 I 5950

Att.(Min.) dB 20 MHz 7200 I 7500 7200 I 7488 dB 20

Freq.Ins.Loss Range2 MHz dB (max) MHz 4900 I 5950 4900 I 5950 0.65 824 I 2500 500 I 2700

Att.(Min.) dB 20 MHz 9800 I 11900 9800 I 11900 dB 18

WLAN (2.4GHz & 5GHz) WLAN (2.4GHz & 5GHz)

TFSD10055950-5001C1
( 5GHz BPF NEW : Low Loss type)

TFSD10055950-5002A2
( 5GHz BPF NEW : High Attt. type)

0.50

20

20

1.20

26

15

Note: The above Specifications subject to change without notice.

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

Thin-Film Low Pass Filters

Products Lineup
Photo Dimensions (LxWxT) mm Applications 0.65 x 0.50 x 0.25mm (0.026 x 0.020 x 0.010 inch) For Cellular Band

-TFSL SeriesNew
Product Name TFSL06050915-4108B1 TFSL06051910-4102B1 TFSL06052170-4113A1 TFSL06050787-4114A1 TFSL06052500-4104B2

For 2.4GHz W-LAN/Bluetooth

Freq.-Range MHz 824 - 915 1710 - 1910 470 - 2170 777 - 787 2400 - 2500 Ins.Loss dB (max) 0.5 0.7 0.5 0.7 0.53 MHz 2400 - 2750 3420-3820 5000 - 6000 1554 -1607 4800 - 5000 dB 20 25 30 25 30

Product Name TFSL06050915-4108B1 TFSL06051910-4102B1 TFSL06052170-4113B1 TFSL06050787-4114A1 TFSL06052500-4104C1

Att.(Min.) MHz 5130 - 5730 2400 - 2500 7200 - 7500 dB 25 15 25 MHz 5150 - 5850 dB 5 -

Notes: The above Specifications subject to change without notice.

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

TDK TFS Series Products Roadmap

Size (mm2) 0.6

- Balun Celluler Under 1.0GHz Band

I.L. 0.6dB MAX. 1.0 x 0.5mm t=0.3+/-0.05mm

0.5

0.4
Celluler Upper 1.5GHz Band WLAN 11a,b/g Bluetooth WiMAX
Low Loss

I.L. 0.5dB MAX.

I.L. 0.6dB MAX.

0.3

0.65 x 0.5mm t=0.25+/-0.05mm 0.65 x 0.5mm t=0.25+/-0.05mm MP I.L. 0.5dB MAX.

0.2

0.6 x 0.3mm t=0.25+/-0.05mm

0.1

0.0 ~ 2011 2012 2013 2014 Year

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

TDK TFS Series Products Roadmap

Size (mm2) 0.6

- Coupler Wide Band Couler ( 700-2700MHz ) Compensated Coupling type & Integrated attenuator type for Celluler

1.0 x 0.5mm t=0.3+/-0.05mm I.L ; 0.2dB MAX.

0.5

Compensated Coupling type I.L ; 0.2dB MAX. I.L ; 0.2dB MAX.

0.4

Single Band Coupler for Celluler WLAN 11a,b/g Bluetooth WiMAX

0.3

0.65 x 0.5mm t=0.25+/-0.05mm MP

0.65 x 0.5mm t=0.25+/-0.05mm I.L ; 0.2dB MAX.

0.2

0.6 x 0.3mm t=0.25+/-0.05mm

0.1

0.0 ~ 2011
Copyright 2011 TDK-EPC Corporation. All rights reserved.

2012

2013

2014

Year

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

TDK TFS Series Products Roadmap

Size (mm2)

- Band Pass Filter 3pole Type

for WLAN 11a,b/g Bluetooth WiMAX 3.0dB max. at 2.4GHz 30dB min. at 1.90GHz 2.0dB max. at 2.4GHz 25dB min. at 2.17GHz

0.6

0.5

1.0 x 0.5mm t=0.30+/-0.05mm

0.4

MP

2pole Type 0.3

for WLAN 11a,b/g Bluetooth WiMAX

3.0dB max. at 2.4GHz 12dB min. at 2.17GHz

0.65 x 0.5mm t=0.25+/-0.05mm

0.2
0.6 x 0.3mm t=0.25+/-0.05mm

0.1 0.0 ~ 2011 2012 2013 2014 Year

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

TDK TFS Series Products Roadmap

Size (mm2)

- Diplexer Diplexer ( LPF/ HPF type ) for Cellular

I.L : 0.50dB MAX (Low Band) 0.70dB MAX (High Band)

0.6

0.5

Diplexer ( LPF/ BPF type ) for WLAN 11a,b/g WiMAX

1.0 x 0.5mm t=0.3+/-0.05mm

0.4

1.0 x 0.5mm t=0.3+/-0.05mm I.L : 0.50dB MAX (Low Band) 0.65dB MAX (High Band) MP 0.65x 0.5mm t=0.25+/-0.05mm I.L : 0.50dB MAX (Low Band) 0.65dB MAX (High Band)

0.3

0.2

0.1

0.0 ~ 2011
Copyright 2011 TDK-EPC Corporation. All rights reserved.

2012

2013

2014

Year

TDK-EPC Corporation Systems Acoustics Waves Business Group

Thin Film Solution

TDK TFS Series Products Roadmap

Size (mm2)

- Low Pass Filter 0.6

I.L. 0.5dB MAX. 1.0 x 0.5mm t=0.3+/-0.05mm

0.5

LPF ( 5order)
for Under 1,0GHz Band Celluler MP

0.4

LPF ( 3 & 5order )

0.3
for Upper 1,7GHz Band Celluler WLAN 11a,b/g Bluetooth WiMAX

I.L. 0.5dB MAX.

I.L. 0.5dB MAX.

0.65 x 0.5mm t=0.25+/-0.05mm MP

0.65 x 0.5mm t=0.25+/-0.05mm

0.2

0.6 x 0.3mm t=0.25+/-0.05mm

0.1

0.0 ~ 2011
Copyright 2011 TDK-EPC Corporation. All rights reserved.

2012

2013

2014

Year

TDK-EPC Corporation Systems Acoustics Waves Business Group

TDK group supports your next Smartphone design with wide technologies.
Power

Power Delivery
Inductor EL Display Finger Navigation Tx BPF Rx BPF Transceiver Base Band Processor Pico Projector PPLN

Battery Li-Ion

Power Management

uDC/DC converter

Antenna

Display

PA

Duplexer

Coupler

Tunable Matching

3G/LTE

Other Camera Interfaces

Camera VCM

RF Solution
GPS WLAN Bluetooth Module MobileTV GPS BPF Diplexer BPF BEF LPF

Antenna

WLAN Bluetooth GPS Mobile TV

Memory MIC

SIM SD

ESD/EMI Flexield

MEMS Microphone

Flexield RFID

RFID

Copyright 2011 TDK-EPC Corporation. All rights reserved.

TDK-EPC Corporation Systems Acoustics Waves Business Group