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RC2004A-BIW-ESX
SPECIFICATION CUSTOMER :
APPROVED BY:
( FOR CUSTOMER USE ONLY )
PCB VERSION:
DATA:
SALES BY
APPROVED BY
CHECKED BY
PREPARED BY
ISSUED DATE:
Page 1 , Total 27 Pages
RC2004A-BIW-ESX
Contents
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. Specification Revision History General Specification Module Classification Information Interface Pin Function Contour Drawing & Block Diagram Function Description Character Generator ROM Pattern Instruction Table Timing Characteristics Initializing of LCM Optical Characteristics Absolute Maximum Ratings Electrical Characteristics Backlight Information Reliability Inspection specification Precautions in use of LCD Modules Page 3 Page 4 Page 5 Page 6 Page 7 Page 8 Page 11 Page 12 Page 13 Page 15 Page 17 Page 18 Page 18 Page 19 Page 20 Page 21 Page 25
2. General Specification
The Features of the Module is description as follow: Module dimension: 98.0 x 60.0 x 13.6 (max.) mm3 View area: 77.0 x 25.2 mm2 Active area: 70.4 x 20.8 mm2 Number of Characters: 20 characters x 4 Lines Dot size: 0.55 x 0.55 mm2 Dot pitch: 0.60 x 0.60 mm2 Character size: 2.95 x 4.75 mm2 Character pitch: 3.55 x 5.35 mm2 LCD type: STN, Negative, Transmissive, Blue Duty: 1/16 View direction: 6 oclock Backlight Type: LED ,White
2004
AB I W ESX
Description
BrandRaystar Optronics Inc. CCharacter Type, Display Type GGraphic Type Display FontCharacter 20 words, 4 Lines. Serials Code. PTN Positive, Gray NTN Negative, GSTN Positive, Gray YSTN Positive, Yellow Green BSTN Negative, Blue FFSTN Positive TFSTN Negative AReflective, N.T, 6:00 KTransflective, W.T,12:00 DReflective, N.T, 12:00 1Transflective, U.T,6:00 GReflective, W. T, 6:00 4Transflective, U.T.12:00 JReflective, W. T, 12:00 0Reflective, U. T, 6:00 3Reflective, U. T, 12:00 BTransflective, N.T,6:00 ETransflective, N.T.12:00 HTransflective, W.T,6:00 NWithout backlight PEL, Blue green TEL, Green DEL, White CTransmissive, N.T,6:00 FTransmissive, N.T,12:00 ITransmissive, W. T, 6:00 LTransmissive, W.T,12:00 2Transmissive, U. T, 6:00 5Transmissive, U.T,12:00 YLED, Yellow Green ALED, Amber RLED, Red WLED, White
LCD Mode
Backlight Type
FCCFL, White GLED, Green ES : English and European standard font Special Code X: Without Negative voltage output
6. Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an instruction register (IR) and a data register (DR). The IR stores instruction codes, such as display clear and cursor shift, and address information for display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM. By the register selector (RS) signal, these two registers can be selected. RS 0 0 1 1 R/W 0 1 0 1 Operation IR write as an internal operation (display clear, etc.) Read busy flag (DB7) and address counter (DB0 to DB7) Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM) Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)
Busy Flag (BF) When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction must be written after ensuring that the busy flag is 0. Address Counter (AC) The address counter (AC) assigns addresses to both DDRAM and CGRAM. Display Data RAM (DDRAM) This DDRAM is used to store the display data represented in 8-bit character codes. Its extended capacity is 808 bits or 80 characters. Below figure is the relationships between DDRAM addresses and positions on the liquid crystal display. High bits Low bits Example: DDRAM addresses 4E AC (hexadecimal) AC6 AC5 AC4 AC3 AC2 AC1 AC0 1 0 0 1 1 1 0
10 11 12 13 50 51 52 53 24 25 26 27 64 65 66 67
Character Generator ROM (CGROM) The CGROM generate 58 dot or 510 dot character patterns from 8-bit character codes. See Table 2. Character Generator RAM (CGRAM) In CGRAM, the user can rewrite character by program. For 58 dots, eight character patterns can be written, and for 510 dots, four character patterns can be written. Write into DDRAM the character code at the addresses shown as the left column of table 1. To show the character patterns stored in CGRAM.
Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns Table 1.
F o r 5 * 8 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 4 3 2 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 C h a ra c te r P a tte rn s ( C G R A M d a ta ) 7 * * * * * * * * * * * * * * * * * 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C h a ra c te r p a tte rn ( 2 ) C u rs o r p a tte rn C h a ra c te r p a tte rn ( 1 ) C u rs o r p a tte rn
H ig h
Low
* 0
* 0
Low 0 0 0 0 0 1 0 1 0 0 0 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 0 0 1 1 0 1 0 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 0 0 1 1
H ig h * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
Low
0 0 0 0 0 0
H ig h
Low
Low
H ig h * 0 * 0 * * * * * * * * * 0 * *
* 0
C h a ra c te r p a tte rn C u rs o r p a tte rn
: " H ig h "
LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH
LLLL
CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8) CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8)
LLLH
LLHL
LLHH
LHLL
LHLH
LHHL
LHHH
HLLL
HLLH
HLHL
HLHH
HHLL
HHLH
HHHL
HHHH
8. Instruction Table
Instruction Code Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Clear Display 0 0 0 0 0 0 0 0 0 1
Write 00H to DDRAM and set DDRAM address to 00H from AC Set DDRAM address to 00H from AC and return cursor to its original position if shifted. The contents of DDRAM are not changed. Assign cursor moving direction and enable the shift of entire display. Set display (D), cursor (C), and blinking of cursor (B) on/off control bit. Set cursor moving and display shift
Description
1.53ms
Return Home Entry Mode Set Display ON/OFF Control Cursor or Display Shift
1.53ms
0 0
0 0
0 0
0 0
0 0
0 0
0 1
1 D
I/D C
SH B
39s 39s
S/C R/L
39s
Function Set Set CGRAM Address Set DDRAM Address Read Busy Flag and Address Write Data to RAM Read Data from RAM
DL
39s
0 0
0 0
0 1
AC5 AC4 AC3 AC2 AC1 AC0 Set CGRAM address in address counter.
39s 39s
AC6 AC5 AC4 AC3 AC2 AC1 AC0 Set DDRAM address in address counter.
Whether during internal operation or not can be known by reading BF. The contents of address counter can also be read. Write data into internal RAM (DDRAM/CGRAM). Read data from internal RAM (DDRAM/CGRAM).
0s
1 1
0 1
D7 D7
D6 D6
D5 D5
D4 D4
D3 D3
D2 D2
D1 D1
D0 D0
43s 43s
dont care
9. Timing Characteristics
9.1 Write Operation
Ta=25, VDD=5.0V Item Enable cycle time Enable pulse width Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data set-up time Data hold time Symbol TC TPW TR,TF tAS tAH tDSW tH Min 1200 140 0 10 40 10 Typ Max 25 Unit ns ns ns ns ns ns ns
9.2
Read Operation
Ta=25, VDD=5V Item Enable cycle time Enable pulse width (high level) Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data delay time Data hold time Symbol TC TPW TR,TF tAS tAH tDDR tH Min 1200 140 0 10 10 Typ Max 25 100 Unit ns ns ns ns ns ns ns
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 1 1 0 * * * * Wait for more than 39us RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 1 0 * * * * 0 0 N F * 0 * * * * * 0 Wait for more than 39 s RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 * * * Function set 0 1 0 * 0 0 0 * * * 0 0 N F * * * Wait for more than 37us RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control * * * 0 0 * 0 0 0 0 * * * 0 * 1 D C B 0 Wait for more than 37 s RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 * * 0 * 0 0 * 0 0 0 * * * 0 1 0 * 0 Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 * * * 0 0 * 0 * * * 0 1 0 0 I/D SH * Initialization ends
BF can not be checked before this instruction. BF can not be checked before this instruction. Function set
4-Bit Ineterface
RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 39us ait RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 37us ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control 0 0 0 0 0 0 1 B C D W for more than 37 s ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 0 0 0 0 0 0 0 1 W for more than 1.53ms ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 0 0 0 0 1 I/D S Initialization ends
BF can not be checked before this instruction.
8-Bit Ineterface
Intensity 100
Selected Wave
Selected Conition
Non-selected Conition
Non-selected Wave
10
Cr Max
Cr = Lon / Loff
100
90
Vop
Driving Voltage(V)
Tr
Tf
[positive type]
[positive type]
Conditions : Operating Voltage : Vop Frame Frequency : 64 HZ Viewing Angle() : 0 0 Driving Waveform : 1/N duty , 1/a bias
b f = 180
= 270
= 90
= 0
Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum).
A K
B/L
LCM
ill never get Vee output from pin15)
15. Reliability
Content of Reliability Test (wide temperature, -20~70) Environmental Test
Test Item
High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation time. time. and the thermal stress to the element for a long time. for a long time. The module should be allowed to stand at 60,90%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20 Thermal shock resistance 30min 5min 1 cycle Total fixed amplitude : 15mm Vibration test Endurance test applying the vibration during transportation and using. Vibration 10~55Hz One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5k Static electricity test Endurance test applying the electric stress to the terminal. CS=100pF 1 time Frequency : 3 30min 25 70 -20/70 10 cycles
Content of Test
Test Condition
200hrs 200hrs 200hrs 200hrs 60,90%RH 96hrs 2
Note
Endurance test applying the high storage temperature for a long 80 Endurance test applying the high storage temperature for a long -30 Endurance test applying the electric stress (Voltage & Current) 70 Endurance test applying the electric stress under low temperature -20
1,2 1
1,2
Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container.
01
Electrical Testing
0.65
02
Black or white 2.1 White and black spots on display 0.25mm, no more than spots on LCD three white or black spots present. (display only) 2.2 Densely spaced: No more than two spots or lines within 3mm 3.1 Round type : As following drawing =( x + y ) / 2 LCD black spots, white spots, contamination (non-display)
2.5
03
2.5
3.2 Line type : (As following drawing) Length Width --W0.02 L3.0 0.02W0.03 L2.5 0.03W0.05 --0.05W
2.5
04
Polarizer bubbles
If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction.
2.5
NO 05
Item Scratches
AQL
Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels:
06
Chipped glass
y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack:
2.5
y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is the total length of each chip.
NO
Item
Criterion
AQL
Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad :
z: Chip thickness 0 zt
06
Glass crack
2.5
y: Chip width x: Chip length z: Chip thickness y L x1/8a 0 zt If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y1/3L x: length xa
NO 07
Criterion The LCD with extensive crack is not acceptable. 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesnt light or color wrong. 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB
X Y
AQL 2.5 0.65 2.5 0.65 2.5 0.65 2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5
08
Backlight elements
09
Bezel
10
PCBCOB
11
Soldering
11.1 No un-melted solder paste may be present on the PCB. 11.2 No cold solder joints, missing solder connections, oxidation or icicle. 11.3 No residue or solder balls on PCB. 11.4 No short circuits in components on PCB.
NO
Item
Criterion 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits. 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever. 12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color. 12.7 Sealant on top of the ITO circuit has not hardened. 12.8 Pin type must match type in specification sheet. 12.9 LCD pin loose or missing pins. 12.10 Product packaging must the same as specified on packaging specification sheet. 12.11 Product dimension and structure must conform to product specification sheet.
AQL 2.5 0.65 2.5 2.5 2.5 2.5 2.5 0.65 0.65 0.65 0.65
12
General appearance
Page: 1
1Panel Specification
1. Panel Type Pass NG , 2. View Direction Pass NG , 3. Numbers of Dots Pass NG , 4. View Area Pass NG , 5. Active Area Pass NG , 6.Operating Temperature Pass NG , 7.Storage Temperature Pass NG , 8.Others 2Mechanical Specification 1. PCB Size Pass NG , 2.Frame Size Pass NG , 3.Materal of Frame Pass NG , 4.Connector Position Pass NG , 5.Fix Hole Position Pass NG , 6.Backlight Position Pass NG , 7. Thickness of PCB Pass NG , 8. Height of Frame to PCB Pass NG , 9.Height of Module Pass NG , 10.Others Pass NG , 3Relative Hole Size 1.Pitch of Connector Pass NG , 2.Hole size of Connector Pass NG , 3.Mounting Hole size Pass NG , 4.Mounting Hole Type Pass NG , 5.Others Pass NG , 4Backlight Specification 1.B/L Type Pass NG , 2.B/L Color Pass NG , 3.B/L Driving Voltage (Reference for LED Type) Pass NG , 4.B/L Driving Current Pass NG , 5.Brightness of B/L Pass NG , 6.B/L Solder Method Pass NG , 7.Others Pass NG ,
Go to page 2
Page 26 , Total 27 Pages
Page: 2 Module Number 5Electronic Characteristics of Module 1.Input Voltage Pass 2.Supply Current Pass 3.Driving Voltage for LCD Pass 4.Contrast for LCD Pass 5.B/L Driving Method Pass 6.Negative Voltage Output Pass 7.Interface Function Pass 8.LCD Uniformity Pass 9.ESD test Pass 10.Others Pass 6Summary
NG , NG , NG , NG , NG , NG , NG , NG , NG , NG ,
Date