The ONFI Mission

Develop a standardized NAND Flash interface Accelerate time to market for NAND-based products

easy integration

full features

a shared platform of NAND innovation

Introducing ONFI 2.3 (EZ-NAND)

NAND device performs ECC and provides

Introducing ONFI 3.0

corrected data to host

Backward-compatible with existing ONFI 2.2 Available in industry-standard packages

(Enabling higher transfer speeds) NV-DDR-400 interface improves transfer speeds

SSTL_18 interface means lower switching power

ONFI Features and Benefits

Feature
Standardized electrical specs and protocol Simplied host discovery of NAND features Maximum transfer speed MT/s I/O signaling voltage Differential signaling On-die termination Packages Interface backwards compatibility Improved power management Enhanced ECC reporting Interleaved reads of LUNs Small data move Change row address command Reset LUN Improved ICC specication Program clear (PC) parameter ECC ZERO (EZ NAND ) interface System signal reduction

and enables faster speeds System signal reduction saves host pins Differential signaling and on-die termination improves signal integrity and allows for faster interface speeds
ONFI 2.2
Async Yes Yes 50 3.3V Sync (DDR) Yes Yes
DDR-200

Benet
More consistency among vendors Eases burden on rmware to identity features based on manufacture and device IDs Faster interface reduces data access time Lower I/O voltage means lower switching power Improves signal integrity enabling faster speeds Improves signal integrity enabling faster speeds VFBGA offers improved reliability and signal integrity Allows fastest devices to be run using slower interfaces Ability to stop the clock lowers power consumption Reports extended ECC correction details to host Improves pipelined reads Minimizes the SRAM required for lower-cost controllers Improves the ability to save host data fragments (short pages) Provides the ability to abort current erase operation for higher priority reads Improves the ability to accurately calculate power requirements for larger systems Improves writes with interleaved reads on another LUN NAND device performs ECC and provides corrected data to host Combines some signals enabling fewer signals to be routed to the host

ONFI 1.0
Yes Yes 50 1.8V

ONFI 2.3
Async Yes Yes 50 3.3V Sync (DDR) Yes Yes
DDR-200

ONFI 3.0
SDR (Async) Yes Yes 50 3.3V NV-DDR (Sync DDR) Yes Yes
DDR-200

NV-DDR2 Yes Yes

DDR-400

1.8V/3.3V

1.8V/3.3V

1.8V/3.3V

1.8V SSTL_18 Yes Yes

TSOP LGA

TSOP LGA

TSOP BGA Async Yes

TSOP LGA

TSOP BGA Async Yes

TSOP LGA

BGA Async Yes

BGA
DDR-200

Async, Yes Yes Yes Yes Yes Yes

Yes Yes Yes Yes Yes

Yes Yes Yes Yes Yes

Yes Yes Yes Yes Yes

Yes Yes Yes Yes Yes

Yes Yes Yes Yes Yes

Yes Yes Yes Yes Yes

Yes Yes

Yes Yes

Yes Yes Yes

Yes Yes Yes

Yes Yes Yes Yes

Yes Yes Yes Yes

Yes Yes Yes Yes

New in this version of the specication.

Contact vendor for specific features supported.

Commercially Available 20nm ONFI 3.0 NV-DDR2 Flash

MLC Flash
16K Page Performance*

SLC Flash
16K Page Performance*

163.8 MB/s 333 MB/s

333 MB/s

333 MB/s

291 MB/s

333 MB/s 8

333 MB/s

333 MB/s

333 MB/s

333 MB/s

164 MB/s

Cache Program

Cache Read

20 MB/s

41 MB/s

73 MB/s

146 MB/s

82 MB/s

Number of die per channel

*Maximum sequential performance assuming no controller overhead.

Number of die per channel

*Maximum sequential performance assuming no controller overhead.

Founders

Additional ONFI Members

AboUnion Technology A-DATA Alcor Micro Aleph One Anobit Technologies Apacer Arasan Chip Systems ASMedia Technology Asolid Tech ATI Avid Electronics Corp BitMicro Biwin Technology Blunk Microsystems, Inc. Cadence Chipsbank Cypress DataFab Systems Inc. Data I/O Datalight,Inc. Densbits Technologies Diablo Technologies ENE Technology Eonsil LLC Entorian Technologies Evatronix FCI FormFactor,Inc Foxconn Fresco Logic Fusion Media Tech Genesys Logic Hagiwara Sys-Com HiperSem Hitachi GST Hyperstone InCOMM Indilinx Inphi Corp. Integrated Device Technology, Inc. IntelliProp Inc. ITE Tech. Inc Jinvani Systech Kingston Technology Lauron Technologies LLC Lotes LSI Macronix International Marvell MemoCom Corp. Mentor Graphics Metaram Moai Electronics Corp. Mobile Semiconductor Molex NeoMagic Corporation Nvidia Orient Semiconductor Electronics OS76 PACTron Palmchip Corporation P.A. Semi, Inc Pliant Technology PMC Sierra Power Quotient International Powerchip Semiconductor Prolific Technology Seagate Shenzhen Netcom Electronics Co Sigmatel Silicon Integrated Systems Silicon Motion, Inc. Silicon Storage Tech STEC Skymedi Corporation Smart Modular Technologies Solid State System Co Super Talent Electronics Synopsys System Level Solutions, Inc. Tandon Tanisys Telechips Teradyne Inc. Testmetrix Transcend Information, Inc TycoElectronics UCA Technology Unity Semiconductor University of York Viking InterWorks Virident Systems Western Digital WinBond

Join our world.

2010 ONFI, Open NAND Flash Interface. Rev. 02/12. PDF: 09005aef83d4fbe6 / Source: 09005aef83d4fc07

onfi.org

333 MB/s