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DATA SHEET
Philips Semiconductors
Preliminary specication
TDA3664
Able to withstand voltages up to 18 V at the output (supply line may be short-circuited) ESD protection on all pins DC short-circuit safe to ground and VP of regulator output Temperature protection (Tj > 150 C). GENERAL DESCRIPTION The TDA3664 is a fixed 5 V voltage regulator with very low dropout voltage/quiescent current, which operates over a wide supply voltage range. The regulator is available as: TDA3664T: SO8 package (non-automotive) TDA3664AT: SO8 package (automotive) TDA3664: SOT223 package (automotive). Automotive: VP 50P V, 40 C Tamb +125 C. Non-automotive: VP 22V, 40 C Tamb +85 C.
MAX.
UNIT
45 45 33 30
V V V A
Voltage regulator VREG regulator output voltage TDA3664T TDA3664 and TDA3664AT IREG VREG(drop) regulator output current dropout voltage 8 V VP 22 V 6 V VP 45 V 0.5 mA IREG 100 mA IREG = 50 mA 4.8 4.75 4.75 5.0 5.0 5.0 0.18 5.2 5.25 5.25 0.3 V V V V
ORDERING INFORMATION TYPE NUMBER TDA3664 TDA3664T TDA3664AT 1999 Sep 01 PACKAGE NAME SO8 SO8 DESCRIPTION plastic surface mounted package; collector pad for good heat transfer; 4 leads plastic small outline package; 8 leads; body width 3.9 mm plastic small outline package; 8 leads; body width 3.9 mm 2 VERSION SOT223 SOT96-1 SOT96-1
Philips Semiconductors
Preliminary specication
TDA3664
REGULATOR BANDGAP
3 (1)
REG
TDA3664
GND
PINNING PIN SYMBOL SOT223 VP GND REG n.c. 1 2 and 4 3 SO8 8 3 1 2, 4, 5, 6 and 7 supply voltage ground regulator output not connected DESCRIPTION
GND
handbook, halfpage
handbook, halfpage
1 2
8 7
TDA3664
3 4
MDA959
6 5
1 VP
2 GND
3 REG
MGL810
n.c.
1999 Sep 01
Philips Semiconductors
Preliminary specication
TDA3664
A temperature protection is included, which switches the regulator output off at IC temperatures above 150 C. A new output structure guarantees the stability of the regulator with an ESR up to 38 . This is very attractive as the ESR of an electrolytic capacitor increases strongly at low temperatures (no expensive tantalum capacitor required).
MAX. V V V V W W
UNIT
+150
C C C C C
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) SO8 SOT223 Rth(j-c) thermal resistance from junction to case (SOT223) in free air PARAMETER thermal resistance from junction to ambient CONDITIONS in free air, soldered in 155 100 25 K/W K/W K/W VALUE UNIT
QUALITY SPECIFICATION In accordance with SNW-FQ-611E. The number of the quality specification can be found in the Quality Reference Handbook.
1999 Sep 01
Philips Semiconductors
Preliminary specication
TDA3664
MAX.
UNIT
V V V A A mA mA
Regulator output: on pin REG (IREG = 0.5 mA), 40 C Tamb 125 C; note 2 VREG regulated output voltage IREG = 0.5 mA, 8 V VP 22 V, Tamb = 25 C IREG = 0.5 mA, 8 V VP 22 V 4.75 0.5 mA IREG 100 mA 6 V VP 45 V; note 2 VREG(line) line regulation voltage 8 V VP 16 V, Tamb = 25 C 7 V VP 22 V, Tamb = 25 C 7 V VP 45 V; note 2 VREG(load) SVRR VREG(drop) IREG(crl) VREG(stab) ILO(rp) Notes 1. The regulator output will follow VP if VP < VREG + VREG(drop) 2. TDA3664T: VP 22 V; 40 C Tamb 85 C. load regulation voltage supply voltage ripple rejection dropout voltage current limit long-term stability output leakage current with reverse polarity input VP = 15 V, VREG 0.3 V 0.5 mA IREG 50 mA fi = 120 Hz; Vripple = 1 Vrms IREG = 50 mA; VP = 4.5 V; Tamb 85 C VREG > 4.5 V 4.75 4.75 50 0.17 5.0 5.0 5.0 1 1 1 10 60 0.18 0.25 20 1 5.25 5.25 5.25 10 30 50 50 0.3 500 V V V mV mV mV mV dB V A mV/1000 h A 4.8 5.0 5.2 V
1999 Sep 01
Philips Semiconductors
Preliminary specication
TDA3664
The output noise is determined by the value of the output capacitor, see Table 1. Table 1
handbook, halfpage
Noise gures NOISE FIGURE (V)(1) CO = 10 F 550 650 CO = 47 F 320 400 CO = 100 F 300 400
VP
REG(3) C2(2)
C1(1) 1 F
TDA3664
2, 4
MDA960
The regulator is stabilized with an external capacitor on the output. The value of this capacitor can be selected using the diagrams shown in Fig.5 and Fig.6. The four examples on the next page show the effects of the stabilization circuit using different values for the output capacitor.
MDA961
MDA962
(1)
102
22
10
stable region 1
1
stable region
(2)
101 101
101
10
C2 (F)
102
10
102
IREG (mA)
103
(1) Maximum ESR (Equivalent Series resistance) at 200 A IREG 100 mA. (2) Minimum ESR only when IREG 200 A.
Fig.5
Fig.6
ESR dependency due to IREG for selecting the right type of output capacitor.
1999 Sep 01
Philips Semiconductors
Preliminary specication
TDA3664
The total thermal resistance of the TDA3664 (SOT223 package) can be decreased to lower values when pin 4 and body of the package are soldered to the printed-circuit board.
Example 2
The regulator is stabilized with an electrolytic output capacitor of 10 F (ESR = 3.3 ). At 40 C, the capacitor value is decreased to 3 F and the ESR is increased to 20 . The regulator will remain stable at a temperature of 40 C.
Example 3
The regulator is stabilized with a 100 nF MKT capacitor on the output. Full stability is guaranteed when the output current is over 200 A. Because the thermal influence on this capacitor value is almost zero, the regulator will remain stable at a temperature of 40 C.
handbook, halfpage
VP
REG(3) C2(2)
Example 4
The regulator is stabilized with a 100 nF capacitor in parallel with a electrolytic capacitor of 10 F on the output. The regulator is now stable under all conditions and independent of: The ESR of the electrolytic capacitor The value of the electrolytic capacitor The output current. APPLICATION CIRCUITS The maximum output current of the regulator equals: 150 T amb 150 T amb I o ( max ) = ----------------------------------------------------- = ------------------------------------ (mA) 100 ( V P 5 ) R th(j-a) ( V P V REG ) When Tamb = 21 C, the maximum output current equals 140 mA at VP =14 V.
C1(1) 1 F
TDA3664
2, 4
MDA960
(1) C1 is optional (to minimize supply noise only). (2) C2 4700 F. (3) VREG = 5 V.
Fig.7
1999 Sep 01
Philips Semiconductors
Preliminary specication
TDA3664
This section gives typical curves for various parameters measured on the TDA3664AT. Standard test conditions are: VP = 14.4 V; Tamb = 25 C.
handbook, halfpage
25
MDA947
Iq (A)
handbook, halfpage
MDA949
Iq (mA) 3
20
15 2 10 1 5
0 0 10 20 VP (V) 30
0 0 10 20 30 40 VP (V) 50
Fig.8
Fig.9
handbook, halfpage
MDA951
handbook, halfpage
(1)
0.48
MDA948
Iq (mA) 1.5
Iq (mA) 0.44
0.40 0.5
(2)
0 40
1999 Sep 01
Philips Semiconductors
Preliminary specication
TDA3664
handbook, halfpage
MDA950
handbook, halfpage
MDA952
Iq (mA) 1.8
Iq (mA) 3
1.6
1
1.4 5 10 15 20 VP (V) 25
handbook, halfpage
5.10
MDA953
handbook, halfpage
MDA955
VREG (V) 4
5.00
4.95 50
50
100
150
200 Tj (C)
0 50
50
100
150
200 Tj (C)
1999 Sep 01
Philips Semiconductors
Preliminary specication
TDA3664
handbook, halfpage
500
MDA957
handbook, halfpage
MDA954
VREG (V) 4
300
2 200
handbook, halfpage
(1)
30
MDA956
SVRR (dB) 40
(2)
50
(3) (1)
60
(2)
70 10
(3)
102
103
104
f (Hz)
105
1999 Sep 01
10
Philips Semiconductors
Preliminary specication
TDA3664
SOT223
c y HE b1 v M A
Q A A1
1
e1 e
2
bp
3
w M B detail X
Lp
2 scale
4 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.8 1.5 A1 0.10 0.01 bp 0.80 0.60 b1 3.1 2.9 c 0.32 0.22 D 6.7 6.3 E 3.7 3.3 e 4.6 e1 2.3 HE 7.3 6.7 Lp 1.1 0.7 Q 0.95 0.85 v 0.2 w 0.1 y 0.1
EUROPEAN PROJECTION
1999 Sep 01
11
Philips Semiconductors
Preliminary specication
TDA3664
SOT96-1
A X
c y HE v M A
Z 8 5
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
8 0o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03S JEDEC MS-012AA EIAJ EUROPEAN PROJECTION
1999 Sep 01
12
Philips Semiconductors
Preliminary specication
TDA3664
If wave soldering is used the following conditions must be observed for optimal results: Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Sep 01
13
Philips Semiconductors
Preliminary specication
TDA3664
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
1999 Sep 01
14
Philips Semiconductors
Preliminary specication
TDA3664
1999 Sep 01
15
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
545002/02/pp16
Sep 01