Hardware Difference Between BSC6910

and BSC6900

Hardware
BSC6900

Difference

Issue

1.00

Date

2013-06-06

2013-6-9

Between

BSC6910

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and

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About This Document

Author
Prepared by

Shailendra Nalavade

Reviewed by

Date

2013-06-06

Date

Reviewed by
Approved by

2013-6-9

Date

HUAWEI Confidential

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Contents
Author

1. Power Connections Between PDF and BSC

2. DIP Switches

3.Subrack Board Configuration

4.Board Level Difference

5.Conclusion

13

References

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1. Power Connection between PDF and BSC

BSC6910:

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In each cabinet, A1 and B1 form a pair of active and standby power supply ports, as do A3 and B3. As
shown in the preceding figure, to create a hot backup, connect ports A1 and A3 to one power supply
group in the PDF, and ports B1 and B3 to a different power supply group.

PEM 00 and PEM 01 work in active and standby mode. As shown in the preceding figure, to create a hot
backup, connect OUTPUT A and OUTPUT B to a different power supply group.
Circuit breakers used on the PDF must be larger than 60 A.

BSC6900:

A1 and B1 in each cabinet serve as a pair of active and standby power supply ports in hot backup mode, and
A3 and B3 in each cabinet serve as a pair of active and standby power supply ports in hot backup mode.
Therefore, as shown in the preceding figure, connect ports A1 and A3 to one power supply group in the PDF,
and ports A3 and B3 to the other power supply group in the PDF.

2. DIP Switches.
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In BSC6910 the DIP switches are Vertical while in BSC6900 they are Horizontal.
BSC6910:

BSC6900:

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Note: The definition of the DIP switches remains the same.

3. Subrack Board Configuration

The Major difference is that the OMU board position is shifted from Rear to front in BSC6910.
BSC6910:

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Configuration of the MPS

BSC6900:
Configuration of the MPS in A over IP mode

4. Board Level Difference.

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i)

The SPU/XPU and DPU processing boards of BSC6900 is replaced by single processing
board EGPU.
This means we have only EGPU boards in BSC6910 for both control and user plane which works in

N+1 configuration.
Also the EGPU boards process both CS and PS user data.
For EGPU board, it automatically adjusts the NodeB or cells on the board. There is no requirement
for specifying Subsystem number while configuring NodeB,

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ii)

The electrical E1/T1 boards are no longer present in BSC6910.

This means EIU,AEU,PEU boards are not present in BSC6910.

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iii) Only higher versions of earlier interface boards are used in BSC6910 (c and above)
a and b versions interface boards are not used.
So we have only AOUc,UOIc,POUc,FG2c,FG2d,GOUc,GOUd.
XOUa is a new board.

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iv)

Introduction for Evolved OMU and Evolved SAU board.

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v)

Introduction of 10GE interface board - EXOUa

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5. Conclusion:
This document helps to introduce about some basic hardware differences between BSC6900 and BSC6910.
Besides the point mentioned in above documents there are many other differences like Resource Sharing,
Management sharing, heat dissipation and others. There are also changes in the configuration part of
Interfaces. Engineers are advised to study the relevant documents for more details.

References:
1. Hedex
2. BSC6910 Training PPT.

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