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NXP Semiconductors

PC board footprint

Footprint information for reflow soldering of TFBGA180 package

SOT570-3

Hx P

Hy

see detail X

Generic footprint pattern Refer to the package outline drawing for actual layout

solder land

solder paste deposit

solder land plus solder paste SL occupied area solder resist SP SR detail X DIMENSIONS in mm P 0.80 SL 0.400 SP 0.400 SR 0.550 Hx Hy

12.575 12.575

SOT570-3_fr

NXP B.V. 2008 . All rights reserved.

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23 October 2008

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