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PC board footprint
SOT570-3
Hx P
Hy
see detail X
Generic footprint pattern Refer to the package outline drawing for actual layout
solder land
solder land plus solder paste SL occupied area solder resist SP SR detail X DIMENSIONS in mm P 0.80 SL 0.400 SP 0.400 SR 0.550 Hx Hy
12.575 12.575
SOT570-3_fr
23 October 2008
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