Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
TM
8/18/2009
TM
8/18/2009
DESCRIPTION Length Outer Shell dia Outer Shell thickness Inner Shell dia Inner Shell thickness Terminal Size Galvanization: Outer Shell Galvanization: Inner Shell
MODEL G-503 3000 mm 50 mm 3.25 mm 26 mm 2.65 mm 30x10 mm / 12 x 12 mm 80-100 micr 200-300 micr
2. 3. 4. 5. 6.
7.
A) B) C)
8/18/2009
D) E)
Fabricating outer shell, inner shell and terminal flat in MS. Hot Dip Galvanization of 80-100 microns in outer shell and 200-300 microns in Inner shell and terminal Filling inside with a special compound which will have the character of fast Conduction. Sealing after internal quality test Packing.
TM
1. Length 2. Shell dia 3. Shell thickness 4. Terminal Only Size Galvanization Outer
5.
80-100micr
6.
Galvanization Inner A) B) C)
200-300micr
8/18/2009
D) E)
Fabricating shell and terminal flat in MS. Hot Dip Galvanization of 80-100 microns in outerl and 200-300 microns in inner. Filling inside with a special compound which will have the character of fast Conduction. Sealing after internal quality test Packing.
INSTALLATION METHOD
TM
Cont..d Cont.d
8/18/2009 6
INSTALLATION METHOD
6. Put little quantity of Moisture Booster Compound in the form of paste inside the drilled hole.
TM
7. Keep the Earthing Electrode inside the hole vertically at centre leaving the terminal portion above ground level. 8. Refill the empty space around the Earthing Electrode with Moisture Booster compound in the form of paste 150 mm layer by layer and compact gently.
9. Pour adequate water at least 5 days twice a day around the electrode.
8/18/2009
TM
COMPARISON
EXISTING METHOD OF EARTHING: 1. GI Pipe with funnel and hole 2. Additional attachment of copper strip 3. Inadequate of Galvanization 4. Require compulsory maintenance 5. More fluctuation in ohmic value 6. Use of charcoal & salt 7. More space required for installation (0.9 m x 0.9 m) (1.2 m x 1.2 m) 8. Dissipation of fault / static current flow is less due to surface area corrosion.
GEETRODE: 1. Dual pipe with flat technology 2. Heavy type of terminal strip 3. Good amount of galvanization upto 100 300 microns 4. Initial watering & no maintenance, no need to change /replace 5. No fluctuation of current & less Ohmic value 6. No charcoal & no salt, filling with moisture booster compound 7. Less space for installation, required maximum 150 mm 200 mm dia bore 8. Fast dissipation of any fault / static current due to more surface area maintaining the moisture contents and no corrosion.
8/18/2009
TM
COMPARISON CHART
OTHER AVAILABLE BRANDS:
1. 2. 3. 4. 5. 6. Only pipe in pipe technology Thin bottom protection of single layer plate Except outer shell, inner shell does not have the direct contact to the bottom (only 70%) Ordinary conducting compound of 1999 technology Very thin terminal Ordinary back fill compound which will take longer duration time to get the desired result ( of 1999 technology) Very thin thickness in the pipe of inner and outer shells No direct terminal for longer duration Normal coating of micron application in the outer shell and inner shell No guarantee for result
GEETRODE:
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. Duel pipe with flat technology Heavy bottom protection 100% contact of outer shell / inner shell and heavy terminal from top to bottom Powerful conducting compound filled inside (of 2006 innovation) Heavy duty terminal of 38 x 10 Special composition of moisture Booster for immediate results ( as per 2006 Technology ) Heavy wall thickness of outer shell and inner shell Special heavy terminal for longer duration Heavy duty micron application in galvanization both in outer shell and inner shell Guarantee for assured result.
7. 8. 9. 10.
8/18/2009
IT SOFTWARE COMPANIES
RAILWAY COMMUNICATION & SIGNALLING MICROWAVE ANTENNAS TELECOMMUNICATION TOWERS POWER GENERATORS TRANSMISSION AND DISTRIBUTION SYSTEMS LIGHTNING PROTECTION SYSTEMS DATA PROCESSING CENTERS OIL REFINERIES & PUMPING STATIONS ALL FACTORIES RESIDENTIAL & COMMERCIAL BUILDINGS DEDICATED NEUTRAL EARTHINGS EQUIPMENT BODY EARTHINGS SURGE PROTECTION SYSTEMS
8/18/2009
10
MAINTENANCE FREE VERY EASY FOR INSTALLATION MORE SURFACE AREA ADEQUATE GALVANISATION HIGHLY CONDUCTIVE NO CORROSION & LEAST FLUCTUATION OF CURRENT CAPACITY TO CARRY HIGH PEAK CURRENT DURABLE AND RELIABLE LONGER LIFE FIT & FORGET TECHNOLOGY MORE SAFER THREE LAYER PROTECTION LESS SPACE FOR INSTALLATION
8/18/2009
11
8/18/2009
Cont.d
12
8/18/2009
13
TEST CERTIFICATE
TM
8/18/2009
14
TEST CERTIFICATE
TM
8/18/2009
15
TEST CERTIFICATE
TM
8/18/2009
16
TM
CONTACT US
AUTHORISED DEALER
Factory : Ambattur Industrial Estate (S.P) Chennai 600 098, India. Contact Persons AMIT VIRWADIA : +91 9833447374 (MUMBAI)
8/18/2009
17